Component mounting system and tape scraps collecting device

ABSTRACT

A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation of U.S. patent application Ser. No. 17/647,196filed on Jan. 6, 2022 which is a continuation of U.S. patent applicationSer. No. 16/930,458 filed on Jul. 16, 2020 which is a continuation ofthe PCT International Application No. PCT/JP2019/003293 filed on Jan.31, 2019, which claims the benefit of foreign priority of Japanesepatent applications No. 2018-079725 and No. 2018-079726 both filed onApr. 18, 2018, the contents all of which are incorporated herein byreference.

BACKGROUND 1. Technical Field

The present disclosure relates to a component mounting system and a tapescraps collecting device including a component mounting device group inwhich a plurality of component mounting devices that mount componentssupplied by a tape feeder on a board are installed while being arrangedin a direction of conveying the board.

2. Description of the Related Art

In a component mounting system, in addition to a component mountingdevice group in which a plurality of component mounting devices areinstalled while being arranged on a floor surface in a direction ofconveying the board, a solder printer, an inspection machine, a reflowdevice, and the like are provided. Each component mounting device thatconfigures the component mounting device group mounts components on theboard that has been conveyed from the upstream side and conveys thecomponents to the downstream side. There are various types of devicesfor supplying components, and a tape feeder is known as one of thetypes.

The tape feeder pitch-feeds a carrier tape in which multiple componentsare accommodated while being arranged in a line and supplies thecomponents to a component supply position. The tape feeder is supportedby a feeder cart, and the feeder cart includes a cutter device that cutsthe carrier tape after supplying the components, and a duct thatdischarges scraps by cutting the carrier tape with the cutter device anddropping the generated scraps of carrier tape, are provided. The scrapsof carrier tape discharged through the duct are stored in a containerprovided in the feeder cart. The scraps of carrier tape stored in thecontainer are regularly discarded by an operator who goes around thecomponent mounting device group. In a case where the number of componentmounting devices is large and the number of tape feeders provided ineach component mounting device is large, the labor for discarding thescraps of carrier tape is enormous. Therefore, it is important from theviewpoint of labor saving to improve the processing of the scraps ofcarrier tape.

Regarding the collection of the scraps of carrier tape, for example,International Publication No. 2015/045018 discloses a configuration inwhich a waste tape transport device is provided inside a componentmounting device. When the plurality of component mounting devices areconnected to each other, the waste tape transport devices are adjacentto each other, and the scraps of carrier tape discharged from eachcomponent mounting device are carried while being delivered between thewaste tape transport devices. Since the scraps of carrier tape generatedfrom each component mounting device are collected in the waste tapetransport device of the component mounting device positioned on the mostdownstream side, the operator may collect the scraps of carrier tapefrom the component mounting device positioned on the most downstreamside without going around each component mounting device, and it ispossible to efficiently collect the scraps of carrier tape.

SUMMARY

According to an aspect of the present disclosure, there is provided acomponent mounting system including: a component mounting device groupin which a plurality of component mounting devices that mount componentssupplied to a board conveyed in from an upstream side by a tape feederand convey the board to a downstream side, and cut a carrier tape aftersupplying the components by a cutter device and discharge scraps ofcarrier tape, are installed on a floor surface while being arranged in adirection of conveying the board; a main conveyor that is installedalong an arrangement direction of the plurality of component mountingdevices in a region on the floor surface under the component mountingdevice group, and conveys the scraps of carrier tape discharged fromeach of the plurality of component mounting devices; and a scrapsstorage that is installed outside the region and stores the scraps ofcarrier tape conveyed by the main conveyor.

According to another aspect of the present disclosure, there is provideda tape scraps collecting device that collects scraps from a componentmounting device group in which a plurality of component mounting devicesthat mount components supplied to a board conveyed from an upstream sideby a tape feeder and convey the board to a downstream side, and cut acarrier tape after supplying the components by a cutter device anddischarge scraps of carrier tape, are installed on a floor surface whilebeing arranged in a direction of conveying the board, the deviceincluding: a main conveyor that is installed along an arrangementdirection of the plurality of component mounting devices in a region onthe floor surface under the component mounting device group, and conveysthe scraps of carrier tape discharged from each of the plurality ofcomponent mounting devices; and a scraps storage that is installedoutside the region and stores the scraps of carrier tape conveyed by themain conveyor.

According to the present disclosure, it is possible to inexpensivelyconstruct a scraps collecting mechanism that collects the scraps ofcarrier tape generated from the tape feeder of each component mountingdevice in one place.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a plan view of a component mounting system according to anembodiment of the present disclosure.

FIG. 2 is a perspective view of a part of the component mounting systemaccording to the embodiment of the present disclosure.

FIG. 3 is a side view of a component mounting device that configures acomponent mounting system according to the embodiment of the presentdisclosure.

FIG. 4 is a side view of a lower portion of the component mountingdevice that configures the component mounting system according to theembodiment of the present disclosure.

FIG. 5 is a perspective view of a part of the component mounting systemaccording to the embodiment of the present disclosure.

FIG. 6 is a perspective view of a scraps collecting mechanism thatconfigures the component mounting system according to the embodiment ofthe present disclosure.

FIG. 7 is a perspective view of a part of the scraps collectingmechanism according to the embodiment of the present disclosure.

FIG. 8 is a view illustrating a state where two conveyor devices thatconfigure a main conveyor of the scraps collecting mechanism accordingto the embodiment of the present disclosure are connected to each other.

FIG. 9 is a perspective view of a part of the scraps collectingmechanism in the embodiment of the present disclosure.

FIG. 10A is a view illustrating a procedure of installing a sub-conveyorthat configures the scraps collecting mechanism according to theembodiment of the present disclosure under a feeder cart.

FIG. 10B is a view illustrating a procedure of installing thesub-conveyor that configures the scraps collecting mechanism accordingto the embodiment of the present disclosure under the feeder cart.

FIG. 10C is a view illustrating a procedure of installing thesub-conveyor that configures the scraps collecting mechanism accordingto the embodiment of the present disclosure under the feeder cart.

FIG. 11 is a side view of a part of the scraps collecting mechanismaccording to a first modification example of the embodiment of thepresent disclosure.

FIG. 12 is a perspective view of the scraps collecting mechanismaccording to a second modification example of the embodiment of thepresent disclosure.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

In the configuration illustrated in International Publication No.2015/045018, it is necessary that each component mounting device has awaste tape transport device embedded therein. Therefore, when an attemptis made to construct a scraps collecting mechanism that collects scrapsof carrier tape generated from a tape feeder of each component mountingdevice in one place, there is a problem that it may take a large amountof costs including the design change of the existing component mountingdevice.

An object of the present disclosure is to provide a component mountingsystem that can inexpensively construct a scraps collecting mechanismthat collects scraps of carrier tape generated from a tape feeder ofeach component mounting device in one place.

Hereinafter, embodiments of the present disclosure will be describedwith reference to the drawings. FIG. 1 illustrates component mountingsystem 1 according to an embodiment of the present disclosure. Componentmounting system 1 is an apparatus that mounts components on board KB tomanufacture mount board JKB, and is installed on the floor surface.Component mounting system 1 includes board supply device 11, screenprinting device 12, slide conveyor 13, first relay conveyor 14, solderinspection device 15, component mounting device 16, second relayconveyor 17, post-mounting inspection device 18, reflow device 19, andmount board collecting device 20, and these devices are arranged inseries in this order from the left side when viewed from operator OP. Inthe present embodiment, the left-right direction (the direction ofconveying board KB) viewed from operator OP is the X-axis direction, andthe front-rear direction viewed from operator OP is the Y-axisdirection. In addition, the up-down direction is the Z-axis direction.

In FIG. 1 , component mounting system 1 has two board conveying paths 1Lextending in the X-axis direction at the front and rear when viewed fromoperator OP, and the component mounting work on board KB can beperformed at the same time in parallel in these two board conveyingpaths 1L. Therefore, in the present embodiment, two board supply devices11, two screen printing devices 12, and two mount board collectingdevices 20 are arranged in the front-rear direction, and slide conveyor13, first relay conveyor 14, solder inspection device 15, four componentmounting devices 16, second relay conveyor 17, post-mounting inspectiondevice 18, and reflow device 19 respectively have two board conveyors atthe front and rear.

Board supply device 11 stocks a plurality of boards KB and suppliesboards KB one by one to the downstream side. Screen printing device 12screen-prints solder on board KB supplied from board supply device 11and conveys the board to the downstream side. Slide conveyor 13distributes and conveys board KB conveyed from screen printing device 12to two board conveying paths 1L. First relay conveyor 14 receives boardKB conveyed from slide conveyor 13 and conveys the board to thedownstream side.

Solder inspection device 15 performs a solder inspection of board KBreceived from first relay conveyor 14. In the solder inspection, it isinspected whether or not a predetermined amount of solder is printed ata predetermined position on board KB. Component mounting device 16mounts components on board KB that has been sent from the upstream sideand conveys the board to the downstream side. In the present embodiment,four component mounting devices 16 are connected to each other in serieson floor surface FL to configure component mounting device group 16G(refer to also FIG. 2 ). The configuration of component mounting device16 that configures component mounting device group 16G will be describedlater.

Second relay conveyor 17 receives board KB conveyed from componentmounting device 16 positioned on the most downstream side of componentmounting device group 16G by conveyor mechanism 17C (FIG. 2 ) andconveys the board to the downstream side. Post-mounting inspectiondevice 18 performs component mounting inspection on board KB receivedfrom second relay conveyor 17. In the component mounting inspection, itis inspected whether or not the component is attached at a predeterminedposition on board KB in a predetermined direction. Post-mountinginspection device 18 conveys board KB to which the component mountinginspection has been completed to the downstream side.

Reflow device 19 performs solder reflow while conveying board KB afterthe component mounting inspection, which is conveyed from post-mountinginspection device 18. Accordingly, after the solder on board KB ismelted, the solder is cooled and solidified, and each component mountedon board KB by component mounting device group 16G is fixed to board KB.Reflow device 19 conveys mount board JKB generated in this manner to thedownstream side. Mount board collecting device 20 receives, collects,and stocks mount board JKB conveyed from reflow device 19.

As illustrated in FIG. 3 , component mounting device 16 includes twoboard conveyors 23 and two mounting heads 24 in a space between base 21and cover member 22. Two board conveyors 23 are arranged at the frontand rear, and each extends in the X-axis direction (the directionperpendicular to the paper surface of FIG. 3 ). These two boardconveyors 23 configure a part of two board conveying paths 1L ofcomponent mounting system 1.

Each board conveyor 23 receives and conveys board KB that has been sentfrom the upstream side, and positions the board at a predeterminedworking position. Two mounting heads 24 are arranged at the front andrear, and each has suction nozzle 25 extending downward. These twomounting heads 24 are moved in the horizontal plane by head movingmechanism 24K.

In FIGS. 2 and 3 , a plurality of tape feeders 26 are provided whilebeing arranged in the X-axis direction respectively at the front andrear of base 21. Each tape feeder 26 is supported by feeder cart 27connected to each of the front and rear of base 21. By connecting feedercart 27 to base 21, the plurality of tape feeders 26 are collectivelyattached to base 21.

In FIG. 3 , feeder cart 27 is provided with a plurality of tape reels 28corresponding to each tape feeder 26. Carrier tape 29 that accommodatesthe components therein is wound around each tape reel 28. Tape feeder 26supplies component PT to component supply port 26K by pulling outcarrier tape 29 from corresponding tape reel 28 and pitch-feeding thecarrier tape. By suctioning component PT supplied to component supplyport 26K by each tape feeder 26 and moving the component by head movingmechanism 24K, mounting head 24 mounts the component onto board KBpositioned at the working position by board conveyor 23. Board KB onwhich component PT is mounted is conveyed by board conveyor 23 to thedownstream side. The operation of each part of component mounting device16 is controlled by control device 16CT included in component mountingdevice 16.

In this manner, each component mounting device 16 performs a series ofcomponent mounting operations in which component PT supplied by tapefeeder 26 is mounted on board KB conveyed from the upstream side and isconveyed to the downstream side. By performing the component mountingoperation while four component mounting devices 16 that configurecomponent mounting device group 16G are adjacent to each other anddeliver board KB, board KB on which components PT in component mountingdevice group 16G have been mounted is conveyed from component mountingdevice 16 positioned on the most downstream side.

In FIG. 3 , cutter device 31 and duct 32 are provided on each feedercart 27 at the front and rear in each component mounting device 16.Cutter device 31 cuts carrier tape 29 after supplying components PT ineach tape feeder 26. Duct 32 is provided below cutter device 31, andguides scraps KZ of carrier tape 29, which is cut by cutter device 31and drops by the own weight, to duct opening 32K opened at the lowerportion of feeder cart 27 (FIG. 4 ).

In this manner, scraps KZ of carrier tape 29 are generated from eachcomponent mounting device 16 that configures component mounting devicegroup 16G, and the amount of scraps KZ of carrier tape 29 generated inthe entire component mounting device group 16G is enormous. Componentmounting system 1 in the present embodiment includes scraps collectingmechanism 40 (tape scraps collecting device) for automaticallycollecting and discarding a large amount of scraps KZ of carrier tape 29generated from component mounting device group 16G in one place withoutmanual labor (FIGS. 2, 5, and 6 ). Scraps collecting mechanism 40 willbe described below.

In FIGS. 5 and 6 , scraps collecting mechanism 40 includes main conveyor41, sub-conveyor 42, disposing conveyor 43, and storage box 44. Mainconveyor 41 is installed in region FA covered with component mountingdevice group 16G on floor surface FL. Main conveyor 41 is installed suchthat the conveying direction is oriented in the arrangement direction(X-axis direction) of four component mounting devices 16. At the endportion (the end portion on the right side when viewed from operator OP)on the downstream side of main conveyor 41 in the conveying direction(X-axis direction), component mounting device 16 positioned on the mostdownstream side is positioned in the vicinity of the right end portion.

In the present embodiment, component mounting system 1 has two boardconveying paths 1L at the front and rear, and two feeder carts 27 at thefront and rear are connected to each other in each component mountingdevice 16 corresponding to two board conveying paths 1L. Therefore, inthe present embodiment, two main conveyors 41 are installed while beingarranged in the Y-axis direction corresponding to two board conveyingpaths 1L provided in component mounting system 1 (that is, correspondingto the rows of feeder carts 27). Two main conveyors 41 are installed inregion FA of floor surface FL under component mounting device group 16Gat a step before component mounting system 1 is installed on floorsurface FL or in a process in which component mounting system 1 isinstalled on floor surface FL.

Each main conveyor 41 may be one long conveyor extending in the X-axisdirection, but in the present embodiment, a plurality of conveyordevices 41B are connected to each other in series (FIG. 6 ). Asillustrated in FIG. 7 , one conveyor device 41B has a configuration inwhich motor 41M drives belt 41C supported by two side walls 41H that areprovided to face each other (here, face each other in the Y-axisdirection) in the horizontal direction. The operation of motor 41M iscontrolled by a host control system (not illustrated) that controls theoverall operation of component mounting system 1.

In FIG. 7 , belt 41C of conveyor device 41B is inclined such that theconveying direction is a direction of the slope from the upstream sideto the downstream side in the direction of board KB. As illustrated inFIG. 8 , in the conveyor devices 41B connected to each other, downstreamside end portion 41K of conveyor device 41B positioned on the upstreamside is positioned below upstream side end portion 41J of conveyordevice 41B positioned on the downstream side. Therefore, the conveyedobject that has been conveyed by conveyor device 41B on the downstreamside and has reached downstream side end portion 41K drops from thereand transfers to upstream side end portion 41J of conveyor device 41B onthe upstream side. In this manner, on main conveyor 41, scraps KZ ofcarrier tape 29, which is the conveyed object, are conveyed from theupstream side to the downstream side.

It is preferable that the plurality of conveyor devices 41B are the sametype, and the length (dimension in the X-axis direction) of one conveyordevice 41B is the same as the lateral width (dimension in the X-axisdirection) of one component mounting device 16. In this case, the numberof connected conveyor devices 41B is the same as the number of componentmounting devices 16 that configure component mounting device group 16G.

In FIG. 4 , sub-conveyor 42 is installed on floor surface FL underfeeder cart 27 included in each component mounting device 16.Sub-conveyor 42 is installed for each feeder cart 27 included in eachcomponent mounting device 16. In the present embodiment, since eachcomponent mounting device 16 has two feeder carts 27 at the front andrear, two sub-conveyors 42 are also installed at the front and rear ofeach component mounting device 16.

As illustrated in FIG. 7 , each sub-conveyor 42 has a configuration inwhich motor 42M drives belt 42C supported by two side walls 42H that areprovided to face each other (here, face each other in the X-axisdirection) in the horizontal direction. The operation of motor 42M iscontrolled by control device 16CT of component mounting device 16positioned above sub-conveyor 42.

In FIG. 6 , of two front and rear sub-conveyors 42 providedcorresponding to each component mounting device 16, the one positionedon the front side of component mounting device 16 is connected to mainconveyor 41 positioned on the front side. Meanwhile, of the two frontand rear sub-conveyors 42 provided corresponding to each componentmounting device 16, the one positioned on the rear side of componentmounting device 16 is connected to main conveyor 41 positioned on therear side.

In FIG. 7 , the conveying direction of belt 42C of each sub-conveyor 42installed on floor surface FL is a horizontal direction. Whensub-conveyor 42 is connected to main conveyor 41, downstream side endportion 42K of sub-conveyor 42 in the conveying direction is positionedabove main conveyor 41 (FIGS. 4 and 7 ). Here, the conveying directionof belt 42C of each sub-conveyor 42 is the horizontal direction, but asillustrated in FIG. 9 , the belt may be inclined such that the conveyingdirection is a direction of the slope from the upstream side (feedercart 27 side) to the downstream side (main conveyor 41 side).

Each sub-conveyor 42 receives scraps KZ of carrier tape 29 dischargedfrom tape feeder 26 of corresponding component mounting device 16through duct 32. Then, by conveying scraps KZ toward the center portionside of component mounting device 16, and dropping scraps KZ of carriertape 29 from downstream side end portion 42K in the conveying direction,scraps KZ are delivered to main conveyor 41.

As illustrated in FIG. 10A, container 27B for containing scraps KZ ofcarrier tape 29 discharged from duct 32 is usually installed in thelower portion of feeder cart 27. In the present embodiment, container27B is removed from feeder cart 27 of each component mounting device 16(FIG. 10B), and sub-conveyor 42 is installed by using space 27S abovefloor surface FL formed by removing container 27B (FIG. 10C). Therefore,each sub-conveyor 42 can be installed after component mounting devicegroup 16G is installed on floor surface FL, and can be connected to mainconveyor 41 already installed on floor surface FL.

In FIG. 6 , disposing conveyor 43 is installed on an extension line ofthe arrangement of component mounting device group 16G outside region FA(FIG. 2 ). In detail, the disposing conveyor is installed on floorsurface FL below second relay conveyor 17 at a position in the vicinityof the terminal end portion of main conveyor 41. Each disposing conveyor43 has a configuration in which motor 43M drives belt 43C supported bytwo side walls 43H that are provided to face each other (here, face eachother in the Y-axis direction) in the horizontal direction. Theoperation of motor 43M is controlled by the above-described host controlsystem that controls the overall operation of component mounting system1.

In FIG. 7 , in the present embodiment, belt 43C of disposing conveyor 43is configured to be inclined in the direction of the slope from theupstream side to the downstream side in the conveying direction.Upstream side end portion 43J of disposing conveyor 43 is positionedbelow downstream side end portion 41K of conveyor device 41B positionedon the most downstream side of the plurality (four here) of conveyordevices 41B that configure main conveyor 41. (FIG. 6 ). Disposingconveyor 43 receives scraps KZ of carrier tape 29 conveyed by mainconveyor 41 to the terminal end portion thereof, and conveys receivedscraps KZ from downstream side end portion 43K to upstream side endportion 43J.

In FIG. 7 , storage box 44 is a box-shaped member that opens upward andis installed outside region FA and on the downstream side of disposingconveyor 43. In a state where storage box 44 and disposing conveyor 43are connected to each other, downstream side end portion 43K ofdisposing conveyor 43 is positioned above storage box 44. Scraps KZ ofcarrier tape 29, which are received from main conveyor 41 by disposingconveyor 43 and conveyed from upstream side end portion 43J towarddownstream side end portion 43K, drop from downstream side end portion43K of disposing conveyor 43 and are disposed of in storage box 44.Storage box 44 stores scraps KZ of carrier tape 29, which are disposedof from disposing conveyor 43.

In this manner, in the present embodiment, disposing conveyor 43 servesas a scraps disposer that receives scraps KZ of carrier tape 29 conveyedby main conveyor 41 and disposes of scraps KZ into storage box 44disposed outside region FA. Further, storage box 44 is a scraps storagethat stores scraps KZ of carrier tape 29 discharged from each of theplurality of tape feeders 26 included in four component mounting devices16.

When component mounting system 1 is in an operating state and eachcomponent mounting device 16 that configures component mounting devicegroup 16G performs a component mounting operation, scraps KZ of carriertape 29 are generated from component mounting device 16, and scraps KZare discharged by the own weight drop from duct 32 provided in feedercart 27. Scraps KZ discharged from duct 32 drop onto sub-conveyor 42installed under feeder cart 27, and are conveyed by sub-conveyor 42toward the center portion side of component mounting device 16. Then,scraps KZ drop from downstream side end portion 42K of sub-conveyor 42and are delivered to main conveyor 41. Main conveyor 41 is alwaysoperating during the operation of component mounting device group 16G,and conveys scraps KZ received from each of the plurality ofsub-conveyors 42 in the same direction as the flow of board KB. ScrapsKZ conveyed by main conveyor 41 are delivered to disposing conveyor 43,and disposing conveyor 43 disposes of scraps KZ into storage box 44.

Here, control device 16CT provided in each component mounting device 16operates each sub-conveyor 42 in accordance with the cutting operationof cutter device 31 that discharges scraps KZ of carrier tape 29 tosub-conveyors 42. Specifically, when cutter device 31 of feeder cart 27performs a cutting operation, control device 16CT operates sub-conveyor42 installed under feeder cart 27 for a predetermined period of time.Scraps KZ of carrier tape 29 discharged from cutter device 31 aredelivered from sub-conveyor 42 to main conveyor 41 when sub-conveyor 42operates for a predetermined period of time. In addition, control device16CT may operate sub-conveyor 42 every time when a plurality of times ofcutting work are operated, instead of operating sub-conveyor 42 everytime cutter device 31 performs the cutting work.

As described above, when scraps KZ of carrier tape 29 are stored instorage box 44, and the appropriate time arrives when the amount ofaccommodated scraps KZ becomes a certain amount, storage box 44 is movedfrom floor surface FL. Then, scraps KZ are picked up from storage box 44and discarded. In the present embodiment, as illustrated in FIG. 7 ,caster 44C is provided at the bottom portion of storage box 44, andstorage box 44 can be easily moved on floor surface FL.

As described above, in component mounting system 1 according to thepresent embodiment, main conveyor 41 is installed so as to extend in thearrangement direction of component mounting devices 16 in the region onfloor surface FL under component mounting device group 16G, and scrapsKZ of carrier tape 29 discharged from each component mounting device 16and delivered from sub-conveyor 42 installed under each feeder cart 27are conveyed outward from underneath of component mounting device group16G. In addition, scraps KZ of carrier tape 29 conveyed by main conveyor41 are stored in storage box 44 installed outside region FA. Sincestorage box 44 stores scraps KZ of carrier tape 29 discharged from alltape feeders 26 included in component mounting device group 16G, bydiscarding scraps KZ of carrier tape 29 stored in storage box 44, theoperator who collects and discards scraps KZ can discard all scraps KZdischarged from four component mounting devices 16 without going aroundeach component mounting device 16.

Further, in component mounting system 1 according to the presentembodiment, the controller (here, each control device 16CT of fourcomponent mounting devices 16) that controls each of the plurality ofsub-conveyors operates each of the plurality of sub-conveyors 42 inaccordance with the cutting operation of cutter device 31 thatdischarges scraps KZ to sub-conveyor 42. Therefore, it is possible toreduce power consumption as compared with a case where the plurality ofsub-conveyors 42 are always in the operating state.

In the first modification example illustrated in FIG. 11 , the scrapsdisposer that receives scraps KZ of carrier tape 29 conveyed by mainconveyor 41 and disposes of scraps KZ to storage box 44 is changed fromdisposing conveyor 43 described above to scraps suction-up device 50.Scraps suction-up device 50 receives scraps KZ of carrier tape 29 thathas been conveyed by main conveyor 41 to the terminal end portionthereof by receiving tray 51, and ejects the scraps to storage box 44from ejection port 53 by suctioning up scraps KZ of carrier tape 29received by receiving tray 51 from suction-up port 52. Even with such aconfiguration, it is possible to obtain the same effect as theconfiguration using disposing conveyor 43.

A second modification example illustrated in FIG. 12 is an example inwhich storage box 44 is installed at a position out of the arrangementof the plurality of component mounting devices 16. In the secondmodification example, the terminal end portion of main conveyor 41 isconnected to a direction changing conveyor 41T that changes theconveying direction from main conveyor 41 side to operator OP side (ormay be the side opposite to operator OP). Then, after connectingdisposing conveyor 43 to the tip of the conveying direction changed bydirection changing conveyor 41T, the conveying direction of disposingconveyor 43 is made to coincide with the changed conveying direction. Inthe second modification example, scraps KZ of carrier tape 29 conveyedby main conveyor 41 can be stored in storage box 44 installed at aposition deviated from operator OP side (or the side opposite tooperator OP) from the region occupied by component mounting system 1 onfloor surface FL. Therefore, the work of moving storage box 44 anddiscarding scraps KZ is easy, and the workability is improved.

As described above, in component mounting system 1 according to thepresent embodiment, main conveyor 41 is installed in region FA on floorsurface FL under component mounting device group 16G along thearrangement direction of component mounting devices 16, and mainconveyor 41 conveys scraps KZ of carrier tape 29 discharged from each ofthe plurality of component mounting devices 16. In addition, scraps KZof carrier tape 29 conveyed by main conveyor 41 are stored in storagebox 44 installed outside region FA, and collected and discarded in oneplace. Since main conveyor 41 is installed on floor surface FL as adevice separate from each component mounting device 16, there is no needto change the design of the equipment on component mounting device 16side and the layout can be freely laid out on floor surface FL forgeneral use, and scraps collecting mechanism 40 can be constructedinexpensively.

Although the embodiments of the present disclosure have been describedabove, the present disclosure is not limited to the description above,and various modifications and the like are possible. For example, in theabove-described embodiment, scraps collecting mechanism 40 is configuredto include a scraps disposer that receives scraps KZ of carrier tape 29conveyed by main conveyor 41 and disposes of scraps KZ into storage box44, but in a case where storage box 44 directly receives scraps KZ ofcarrier tape 29 conveyed to the terminal end portion by main conveyor 41(for example, in a case where a recessed portion is provided on floorsurface FL and storage box 44 is accommodated in the recessed portion)and the like, the scraps disposer becomes unnecessary. Further, in theabove-described embodiment, main conveyor 41 conveys scraps KZ in thedirection from the upstream side to the downstream side of the flow ofboard KB, but on the contrary, scraps KZ may be conveyed in thedirection from the downstream side to the upstream side of the flow ofboard KB.

Further, in the above-described embodiment, scraps collecting mechanism40 includes the plurality of sub-conveyors 42, and the plurality ofsub-conveyors 42 receive scraps KZ of carrier tape 29 discharged fromeach of the plurality of component mounting devices 16 and deliver thescraps to main conveyor 41, but when main conveyor 41 directly receivesscraps KZ discharged from each component mounting device 16,sub-conveyor 42 becomes unnecessary. Further, in the above-describedembodiment, each of the plurality of sub-conveyors 42 operates inaccordance with the cutting operation of carrier tape 29 by cutterdevice 31, but similar to main conveyor 41, the sub-conveyor may bealways operating during the operation of component mounting device group16G.

There is provided a component mounting system and a tape scrapscollecting device that can inexpensively construct a scraps collectingmechanism that collects the scraps of carrier tape generated from thetape feeder of each component mounting device in one place.

What is claimed is:
 1. A component mounting system comprising: acomponent mounting device group including a plurality of componentmounting devices, the plurality of component mounting devices beingarranged on a floor surface in a direction of conveying a board, thecomponent mounting device group defining a space under the componentmounting device group, each of the plurality of component mountingdevices being configured to: mount a component supplied by a tape feederfrom a carrier tape onto the board conveyed from an upstream side; andcut the carrier tape by a cutter device after supplying the componentfrom the carrier tape to the board; and discharge scraps of the carriertape; a main conveyor installed along the arrangement of the pluralityof component mounting devices, wherein the main conveyor is installedunder the component mounting device group, the main conveyor beingconfigured to convey the scraps discharged from the carrier tape; adirection changing conveyor connected to a terminal end portion of themain conveyor, the direction changing conveyor being configured tochange a conveying direction of the scraps delivered by the mainconveyor; and a scraps storage installed outside the space, the scrapsstorage being configured to store the scraps conveyed by the directionchanging conveyor.
 2. The component mounting system according to claim1, wherein the main conveyor includes a plurality of conveyor devicesconnected to each other in series.
 3. The component mounting systemaccording to claim 1, further comprising: a plurality of sub-conveyorsinstalled on the floor surface under a feeder cart that supports thetape feeder, each of the plurality of sub-conveyors being configured to:receive and convey the scraps discharged from the tape feeder supportedby the feeder cart; and deliver the scraps to the main conveyor.
 4. Thecomponent mounting system according to claim 3, wherein each of theplurality of sub-conveyors is configured to convey the scraps to themain conveyor in a first direction, and the main conveyor is configuredto convey the scraps in a second direction being different from thefirst direction.
 5. The component mounting system according to claim 3,further comprising: a controller configured to operate one sub-conveyoramong the plurality of sub-conveyors in accordance with a cuttingoperation of the cutter device that discharges the scraps to the onesub-conveyor.
 6. The component mounting system according to claim 5,wherein, the controller operates the one sub-conveyor that receives thescraps discharged from the cutter device for a predetermined period oftime when the cutter device performs the cutting operation.
 7. Thecomponent mounting system according to claim 1, further comprising: ascraps disposer configured to dispose of the scraps conveyed by thedirection changing conveyor into the scraps storage.
 8. The componentmounting system according to claim 1, wherein, the scraps storage has aplurality of casters.